Apparatus for picking up semiconductor chips and method of picking up semiconductor chips

The present invention provides a pickup apparatus, which reliably and easily picks up a semiconductor chip from an absorbing plate. The pickup apparatus having a vacuum nozzle for picking up a semiconductor chip attached to the absorbing plate includes a support body 1 formed with vacuuming holes fo...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SHIRAISHI, TOSHIRO, SATO, YUICHI, KAWABE, KATSUYOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention provides a pickup apparatus, which reliably and easily picks up a semiconductor chip from an absorbing plate. The pickup apparatus having a vacuum nozzle for picking up a semiconductor chip attached to the absorbing plate includes a support body 1 formed with vacuuming holes for vacuuming and holding the peripheral part of the semiconductor chip kept on the absorbing plate 2 by the nozzle and a swing member 11 which contacts with the lower side of the semiconductor chip picked up by the nozzle from the absorbing plate and rises up while horizontally moving from the end of the chip to its center.