Double-sided printed circuit board without via holes and method of fabricating the same

Disclosed is a method of fabricating a double-sided PCB without via holes, functioning to transport electric signals between both sides of the PCB, by folding a flexible substrate, in which circuit patterns are formed on only one side of the flexible substrate, and the double-sided PCB without the v...

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Bibliographische Detailangaben
Hauptverfasser:	KANG, JANG-KYU, SUN, BYUNG-KOOK, RYU, CHANG-SUP
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	Disclosed is a method of fabricating a double-sided PCB without via holes, functioning to transport electric signals between both sides of the PCB, by folding a flexible substrate, in which circuit patterns are formed on only one side of the flexible substrate, and the double-sided PCB without the via holes fabricated by the method. Therefore, the method is advantageous in that it allows PCB manufacturers to save the efforts for forming and protecting the via holes because the double-sided PCB does not need via holes, and reduces its fabricating cost and time, due to simplicity of this method.