A semiconductor device

A semiconductor device

The purpose of the aligner of the present invention is to provide a flip chip BGA which can exhibit a high-speed electric transmission characteristic while minimizing the formation of voids in a sealing resin filled between a semiconductor chip and a wiring board. In a silicon chip 1A having a flip...

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Hauptverfasser: USAMI, MASAMI, KATAGIRI, MITSUAKI, UJIIE, KENJI
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator USAMI, MASAMI
KATAGIRI, MITSUAKI
UJIIE, KENJI
description The purpose of the aligner of the present invention is to provide a flip chip BGA which can exhibit a high-speed electric transmission characteristic while minimizing the formation of voids in a sealing resin filled between a semiconductor chip and a wiring board. In a silicon chip 1A having a flip chip mounted on a package board, a power supply circuit, an input/output circuit and a plurality of bonding pads BP are positioned in the central area of the major surface thereof; and solder bumps 6 electrically connected to the bonding pads BP via Cu wiring 10 are positioned in the form of a matrix in the area of the major surface other than the central area. One (VDDQ) of the solder bumps 6 for input/output power and one (DQ) of the solder bumps 6 for data signal input/output are positioned in a first area adjacent to the central area, and one (ADR) of the bumps 6 for address signal input are positioned in a second area outside the first area.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title A semiconductor device
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