Electronic testing structure assembly

A new electronic testing structure for electronic device, which can test the electronic devices using one or plural pads, would be proposed in this invention. This structure includes one or plural upper plate with elastic structure. One or plural electronic pads and measurement pads would be formed on the said electronic devices. The electronic signal connection between the said electronic pads and said measurement pads could be established by the measurement signal wires. This testing structure also comprises lower plate directly thereon the said upper plate and said electronic devices. Both the said upper plate and said lower plate are configured to receive the said one or plural electronic devices in a predetermined orientation. One or plural contact structures formed on the said lower plate would be electronically contact the said measure pads.