Under-bump-metallurgy layer
An under-bump-metallurgy layer (UBM layer) is suited for forming between a pad of a chip (die) and a solder bump, wherein the composition of the solder bump comprises tin. The UBM layer has an adhesion layer deposed on the pad, a Ni-V layer deposed on the adhesion layer, a wettable layer on the Ni-V...
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| creator | TAO, SU CHEN, WILLIAM TZE-YOU LEE, CHUNI WU, JENG-DA+ TONG, HO-MING |
| description | An under-bump-metallurgy layer (UBM layer) is suited for forming between a pad of a chip (die) and a solder bump, wherein the composition of the solder bump comprises tin. The UBM layer has an adhesion layer deposed on the pad, a Ni-V layer deposed on the adhesion layer, a wettable layer on the Ni-V layer, and a barrier layer deposed on the wettable layer. The barrier layer prevents nickel of the Ni-V layer passing through itself, and reacts with both tin of the solder bump and the wettable layer to form inter-metallic compound (IMC). Besides, another UBM layer has an adhesion layer deposed on the pad, a wettable layer deposed on the adhesion layer, and a Ni-V layer on the wettable layer. The Ni-V layer reacts with both tin of the solder bump and the wettable layer to form IMC. |
| format | Patent |
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The UBM layer has an adhesion layer deposed on the pad, a Ni-V layer deposed on the adhesion layer, a wettable layer on the Ni-V layer, and a barrier layer deposed on the wettable layer. The barrier layer prevents nickel of the Ni-V layer passing through itself, and reacts with both tin of the solder bump and the wettable layer to form inter-metallic compound (IMC). Besides, another UBM layer has an adhesion layer deposed on the pad, a wettable layer deposed on the adhesion layer, and a Ni-V layer on the wettable layer. 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The UBM layer has an adhesion layer deposed on the pad, a Ni-V layer deposed on the adhesion layer, a wettable layer on the Ni-V layer, and a barrier layer deposed on the wettable layer. The barrier layer prevents nickel of the Ni-V layer passing through itself, and reacts with both tin of the solder bump and the wettable layer to form inter-metallic compound (IMC). Besides, another UBM layer has an adhesion layer deposed on the pad, a wettable layer deposed on the adhesion layer, and a Ni-V layer on the wettable layer. The Ni-V layer reacts with both tin of the solder bump and the wettable layer to form IMC.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Under-bump-metallurgy layer |
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