Radio frequency power amplifier module integrated with a power control loop

A radio frequency (RF) power amplifier module integrated with a power control loop is formed on a print circuit board and encapsulated within a mold. In order to minimize an overall size of the RF power amplifier module, capacitors with a smaller size are employed to substitute for prior art ceramic directional couplers. In addition to the capacitors, RF power amplifiers, matching circuits, power detectors, and a power control specific application integrated circuit are all integrated on the print circuit board without respective packages. Furthermore, the RF power amplifiers and the power detectors are formed on a common semiconductor substrate. Therefore, the RF power amplifier module has advantages of a fine size and minimum parasitic impedance.