Liquid crystal display device

The present invention is related to a kind of liquid crystal display device and is particularly related to the effective technique for the driving means (drain driver) of image signal line in liquid crystal display apparatus capable of performing multi-level display. The subject of the present inven...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SAITO, MASANARI, GOTO, MITSURU, YAMASHITA, YUJI, OGURA, AKIRA+, YASUKAWA, SHINJI
Format:	Patent
Sprache:	eng
Schlagworte:	ADVERTISING ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICESUSING STATIC MEANS TO PRESENT VARIABLE INFORMATION BASIC ELECTRIC ELEMENTS CRYPTOGRAPHY DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING DISPLAY EDUCATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS SEALS SEMICONDUCTOR DEVICES TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	The present invention is related to a kind of liquid crystal display device and is particularly related to the effective technique for the driving means (drain driver) of image signal line in liquid crystal display apparatus capable of performing multi-level display. The subject of the present invention is to provide a liquid crystal display apparatus that has small occupation areas for the bump electrode of semiconductor chip inside the image line driving means and a protective diode pair so as to reduce chip size of a semiconductor chip. The semiconductor chip inside the image signal line driving means is provided with plural bump electrodes, plural protection diode pairs, and plural wiring layers having connection portions with each bump electrode. Each one of the wiring layers on the anode area of the first diode and the cathode area of the second diode of each protection diode pair is formed to have the same shape. Each bump electrode is disposed in the anode area of the first diode or the cathode area of the second diode of the protection diode pair. In addition, the anode area of the first diode or the cathode area of the second diode of the protection diode pair is connected with the connection portion of the wiring layer.