Method and device for assembling substrates
In order to reduce cycle times for assembling at least two substrates and to form an optical data carrier in a low-pressure chamber, in which an opening of the low-pressure chamber is sealed in relation to the surrounding environment, the low-pressure chamber is pumped out, and a transfer chamber is...
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creator | LEONHARDT, STEPHAN WAGNER, ROLAND DR SPEER, ULRICH |
description | In order to reduce cycle times for assembling at least two substrates and to form an optical data carrier in a low-pressure chamber, in which an opening of the low-pressure chamber is sealed in relation to the surrounding environment, the low-pressure chamber is pumped out, and a transfer chamber is formed between a first handling device arranged in the low-pressure chamber and a second handling device arranged outside the low-pressure chamber by respectively sealing the opening of the low-pressure chamber. The transfer chamber has a smaller volume than that of the low-pressure chamber. The substrates in the transfer chamber are transferred from the second handling device to the first handling device. The substrates are conveyed with the first handling device to an assembly station in the low-pressure chamber when the low-pressure chamber is sealed by the second handling device and the substrates are assembled in the assembly station. |
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The transfer chamber has a smaller volume than that of the low-pressure chamber. The substrates in the transfer chamber are transferred from the second handling device to the first handling device. The substrates are conveyed with the first handling device to an assembly station in the low-pressure chamber when the low-pressure chamber is sealed by the second handling device and the substrates are assembled in the assembly station.</description><edition>7</edition><language>eng</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; INFORMATION STORAGE ; INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER ; PERFORMING OPERATIONS ; PHYSICS ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20031121&DB=EPODOC&CC=TW&NR=563125B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25555,76308</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20031121&DB=EPODOC&CC=TW&NR=563125B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LEONHARDT, STEPHAN</creatorcontrib><creatorcontrib>WAGNER, ROLAND DR</creatorcontrib><creatorcontrib>SPEER, ULRICH</creatorcontrib><title>Method and device for assembling substrates</title><description>In order to reduce cycle times for assembling at least two substrates and to form an optical data carrier in a low-pressure chamber, in which an opening of the low-pressure chamber is sealed in relation to the surrounding environment, the low-pressure chamber is pumped out, and a transfer chamber is formed between a first handling device arranged in the low-pressure chamber and a second handling device arranged outside the low-pressure chamber by respectively sealing the opening of the low-pressure chamber. The transfer chamber has a smaller volume than that of the low-pressure chamber. The substrates in the transfer chamber are transferred from the second handling device to the first handling device. The substrates are conveyed with the first handling device to an assembly station in the low-pressure chamber when the low-pressure chamber is sealed by the second handling device and the substrates are assembled in the assembly station.</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>INFORMATION STORAGE</subject><subject>INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZND2TS3JyE9RSMxLUUhJLctMTlVIyy9SSCwuTs1NysnMS1coLk0qLilKLEkt5mFgTUvMKU7lhdLcDPJuriHOHrqpBfnxqcUFicmpeakl8SHhpmbGhkamTk7GhFUAAMYrKPQ</recordid><startdate>20031121</startdate><enddate>20031121</enddate><creator>LEONHARDT, STEPHAN</creator><creator>WAGNER, ROLAND DR</creator><creator>SPEER, ULRICH</creator><scope>EVB</scope></search><sort><creationdate>20031121</creationdate><title>Method and device for assembling substrates</title><author>LEONHARDT, STEPHAN ; WAGNER, ROLAND DR ; SPEER, ULRICH</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW563125BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2003</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>INFORMATION STORAGE</topic><topic>INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>LEONHARDT, STEPHAN</creatorcontrib><creatorcontrib>WAGNER, ROLAND DR</creatorcontrib><creatorcontrib>SPEER, ULRICH</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LEONHARDT, STEPHAN</au><au>WAGNER, ROLAND DR</au><au>SPEER, ULRICH</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method and device for assembling substrates</title><date>2003-11-21</date><risdate>2003</risdate><abstract>In order to reduce cycle times for assembling at least two substrates and to form an optical data carrier in a low-pressure chamber, in which an opening of the low-pressure chamber is sealed in relation to the surrounding environment, the low-pressure chamber is pumped out, and a transfer chamber is formed between a first handling device arranged in the low-pressure chamber and a second handling device arranged outside the low-pressure chamber by respectively sealing the opening of the low-pressure chamber. The transfer chamber has a smaller volume than that of the low-pressure chamber. The substrates in the transfer chamber are transferred from the second handling device to the first handling device. The substrates are conveyed with the first handling device to an assembly station in the low-pressure chamber when the low-pressure chamber is sealed by the second handling device and the substrates are assembled in the assembly station.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER PERFORMING OPERATIONS PHYSICS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
title | Method and device for assembling substrates |
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