Method of making member for dual connection plate of circuit board

A kind of method of making member for dual connection plate of circuit board is disclosed in the present invention. In the invention, a dual-connection plate having 2N substrates is provided, in which N is a positive integer. On the positive face of the dual-connection plate, positive faces of N sub...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	KO, KEVIN
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A kind of method of making member for dual connection plate of circuit board is disclosed in the present invention. In the invention, a dual-connection plate having 2N substrates is provided, in which N is a positive integer. On the positive face of the dual-connection plate, positive faces of N substrates and reverse faces of the other N substrates are provided. The dual-connection plate is sent to the machine for making member so as to respectively form plural positive-face components and plural reverse-face components on the positive faces of N substrates and on the reverse faces of another N substrates. The dual-connection plate is turned over. Then, the dual-connection plate is sent to the machine for making member so as to form another plural positive-face components on the positive faces of another N substrates, and to form another plural reverse-face components on the reverse faces of N substrates.