Ultra fine pitch capillary

A bonding tool for bonding a fine wire to bonding pads having a very fine pitch is disclosed. The bonding tool comprises a working tip at an end thereof. The working tip includes (i) a tapered section having a predetermined angle with respect to the longitudinal axis of the first cylindrical section...

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Bibliographische Detailangaben
Hauptverfasser:	BAHALUL, ARIE, ATZMON, ZIV, SONNENREICH, BENJAMIN, PERLBERG, GIL
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A bonding tool for bonding a fine wire to bonding pads having a very fine pitch is disclosed. The bonding tool comprises a working tip at an end thereof. The working tip includes (i) a tapered section having a predetermined angle with respect to the longitudinal axis of the first cylindrical section, (ii) a working face with a first annular chamfer formed at an outside portion of an end of the working tip and, (iii) a second annular chamfer formed at an inside portion of the end of the working tip. The first and second annular chamfer adjacent one another and a substantially cylindrical axial passage coupled to an upper portion of the second annular chamfer. The bonding tool is formed from a material containing at least 80% ZrO2 by weight.