Method and materials for printing particle-enhanced electrical contacts

The disclosed invention relates to materials and processes for creating particle-enhanced bumps on electrical contact surfaces through stencil or screen printing processes. The materials are mixtures of conductive ink, conductive paste, or conductive adhesive and conductive hard particles. The process involves depositing the mixture onto electrical contact surfaces by stencil printing, screen printing, or other dispensing techniques. In another embodiment, the ink, paste, or adhesive is first stenciled or screen printed and the particles are then applied on top of the ink, paste, or adhesive deposit. Once cured, the deposition provides a hard, electrical contact bump on the contact surface with a rough, conductive, sandpaper-like surface that can be easily connected to an opposing contact surface without any further surface preparation of either surface.