Structure of solder bump

A structure of a solder bump is suited for being located on a pad of a die. The structure comprises a UBM layer (under bump metallurgy layer) and a solder bump, wherein the UBM layer is located on the pad, and the bump is located on the UBM layer. The material of the bump includes tin. The bump has...

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Bibliographische Detailangaben
Hauptverfasser:	TAO, SU, CHEN, WILLIAM TZE-YOU, LEE, CHUNI, WU, JENG-DA+, TONG, HO-MING
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A structure of a solder bump is suited for being located on a pad of a die. The structure comprises a UBM layer (under bump metallurgy layer) and a solder bump, wherein the UBM layer is located on the pad, and the bump is located on the UBM layer. The material of the bump includes tin. The bump has a plurality of metal particles that are doped inside the bump and react with tin to generate IMC (inter-metallic compound). Besides, the material of the metal particles is selected from a group comprising copper, silver, and nickel.