LGA package socket

A socket for an LGA or BGA package is provided which is of relatively simple construction and which provides reliable and efficient interconnection of the package and a printed circuit board. The socket comprises a contact assembly having an array of resilient conductive columns having respective co...

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Bibliographische Detailangaben
Hauptverfasser:	GOODWIN, JONATHAN W, BURTON, ROY
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	A socket for an LGA or BGA package is provided which is of relatively simple construction and which provides reliable and efficient interconnection of the package and a printed circuit board. The socket comprises a contact assembly having an array of resilient conductive columns having respective contact ends, the columns being mounted on a thin insulative sheet. The contact assembly is supported on a frame of insulating material and which had alignment post for alignment of the contact assembly to the frame and for alignment of the frame and mounted contact assembly to an associated circuit board. The frame also includes elements for soldering or bonding the socket to a circuit board.