Semiconductor device and fabrication process thereof
A semiconductor device includes a pad electrode formed on a substrate and a bump electrode formed on the pad, wherein the pad electrode carries an uneven flaw, and there is provided a pattern between the pad electrode and the bump electrode such that the pattern covers the flaw.
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A semiconductor device includes a pad electrode formed on a substrate and a bump electrode formed on the pad, wherein the pad electrode carries an uneven flaw, and there is provided a pattern between the pad electrode and the bump electrode such that the pattern covers the flaw. |
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