Film carrier tape for mounting multiple-strip electronic components and manufacturing method of the same

The present invention provides a manufacturing method of film carrier tape for mounting multiple-strip electronic components, and film carrier tape for mounting multiple-strip electronic components. It is the film carrier tape for multi-strip electronic component mounting, in which a plurality of film carrier tapes for mounting the electronic components of a desired width are formed in a parallel connected state, while sandwiching an insulation film having a predetermined width obtained by adding a width, capable of forming holes necessary to position the insulation film in a width which is integral number times of the width of the carrier tape for mounting the desired component between roller, without using sprocket wheels for conveying and rotating the rollers, in a state in which the plurality of the carrier tapes are connected in parallel. Therefore, it is capable of markedly improving the manufacturing capability of the film carrier tape for mounting the component via one-row manufacturing line without the need for replacing various components which correspond to the width of the carrier tape for mounting a plurality of types of the electronic components.