Semiconductor packaging process and the package thereof

A thick, heat-resistant adhesive tape is applied in the present invention, and its surface is coated with a Copper layer, photoresist with good photosensitivity is coated on the Copper layer, use negative film with circuit pattern to expose it by light source, so that the photoresist remains on the surface of the Copper layer. Proceed etching operation to leave the Copper wire having circuit pattern, bond the chip to the Copper wire by wire-bonding or flip-chip, package in appropriate packaging way, tear off the heat-resistant adhesive tape to form the package.