Interconnection circuit and method of fabricating the same

A interconnection circuit includes a dielectric plane having conductors fabricated from copper disposed on each side of the dielectric plane. An opening known as a via disposed through the dielectric plane includes a conductive link between the conductors disposed on either side of the dielectric plane. The conductive link includes a first layer fabricated from copper and a second layer of Nickel disposed over the copper layer to strengthen the first layer and prevent fractures known as barrel cracks in the conductive link. A third layer composed of Gold is deposited over the second layer to protect the second layer of Nickel from corrosion. In another embodiment of the subject invention the third layer is composed of an easily cleaned or removed metal and a coating of Gold is deposited in specific discrete locations to facilitate wire bonding or soldering.