Polymer stud grid array and a process to manufacture this kind of polymer stud grid array

Polymer stud grid array and a process to manufacture this kind of polymer stud grid array

A first wiring layer (V1) and metallized through holes (D) are formed on a substrate (S). Then a substrate layer is provided on the upper side (01) of the substrate (S) by means of inject casting, whereby the material runs throughout the metallized through holes (D) and polymer protuberances (PS) ap...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: PUYMBROECK, JOZEF VAN
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A first wiring layer (V1) and metallized through holes (D) are formed on a substrate (S). Then a substrate layer is provided on the upper side (01) of the substrate (S) by means of inject casting, whereby the material runs throughout the metallized through holes (D) and polymer protuberances (PS) appear on the beneath side (U) of the substrate (S). A second wiring layer (V2) formed on the substrate layer (SL) is electrically connected with the first wiring layer (V1) via the sack metallized through holes (SD) and thereby electrically connected with out connections (AA) on the polymer protuberances (PS).