A semiconductor packaging process for ball grid array (BGA)

A semiconductor packaging process for ball grid array comprises: providing a substrate, dispensing adhesive, attaching dices on the substrate, wire bonding, molding, and balls implanting. The adhesive is dispensing on the adhesive areas of the substrate by a dispenser for attaching active surfaces of the dices. The quantity of the adhesive is controlled well, so that is improving the yield of the semiconductor packaging without increasing the extra cost. For semiconductor packaging industry, the adhesive is produce and use widely, so this semiconductor packaging process is increasing the yield of packing and reducing the cost.