Damascene-gate process for the fabrication of MOSFET devices
A sub-0.1 m MOSFET device having minimum poly depletion, salicided source and drain junctions and very low sheet resistance poly-gates is provided utilizing a damascene-gate process wherein the source and drain implantation activation annealing and silicidation occurs in the presence of a dummy gate...
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creator | BRODSKY, STEPHEN BRUCE HANAFI, HUSSEIN IBRAHIM ROY, RONNEN ANDREW BOYD, DIANE CATHERINE |
description | A sub-0.1 m MOSFET device having minimum poly depletion, salicided source and drain junctions and very low sheet resistance poly-gates is provided utilizing a damascene-gate process wherein the source and drain implantation activation annealing and silicidation occurs in the presence of a dummy gate region which is thereafter removed and replaced with a polysilicon gate region. |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Damascene-gate process for the fabrication of MOSFET devices |
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