Magnetron plasma processing apparatus
When subjecting a substrate (30) to magnetron plasma processing, a dipole magnet (21) having a plurality of anisotropic segment magnets (22) arranged around an outer wall of a chamber (1) in a ring-shape is provided to thereby form a magnetic field gradient having a magnetic field intensity that gra...
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Sprache: | eng |
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Zusammenfassung: | When subjecting a substrate (30) to magnetron plasma processing, a dipole magnet (21) having a plurality of anisotropic segment magnets (22) arranged around an outer wall of a chamber (1) in a ring-shape is provided to thereby form a magnetic field gradient having a magnetic field intensity that gradually decreases from an E pole side toward a W pole side in a plane which intersects perpendicularly with a direction of an electric field between spaced pairs of parallel electrodes along a direction that intersects perpendicularly with a magnetic field direction B. The plurality of anisotropic segment magnets include a first portion (a) which is constituted by the anisotropic segment magnets that are arranged in the vicinity of a domain (A) at the outer side of an end portion of an E pole side of the processed substrate and that have the N poles thereof oriented toward the domain, and a second portion (b) which is constituted by the anisotropic segment magnets that are arranged to have the S poles thereof oriented toward the domain. By means of the first portion and the second portion, the magnetic field intensity of the first and second domains can be partly increased. |
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