Sample assembly for thermoelectric measuring instrument

The object of the present invention is to provide a sample assembly for thermoelectric measuring instrument to reduce the contact electromotive force and thermoelectromotive force by improving the thermal uniformity property of the assembly by sticking the assembly to a substrate through an indium adhesive layer in a thermoelectric measuring instrument. In the present solution, an aluminum nitride substrate 12 has an insulating property and good thermal conductivity. An intermediate layer 16 is formed at the center of the substrate 12, and relay terminal layers 24 and 26 are formed at both ends of the substrate 12. A three-layer structure of Ti, Mo, and Au layers is formed from the substrate 12 side. A GaAs sample is stuck to the upper surface of the intermediate layer 16 through an adhesive layer 18 composed of indium having good thermal conductivity. On the upper surface of the sample 14, a pair of electrode layers 20 and 22 is formed at an interval. Each of the electrode layers 20 and 22 is formed in a three-layer structure of AuGe, Ni, and Au layers from the sample 14 side. The electrode layers 20 and 22 of the sample 14 are respectively connected to the relay electrode layers 24 and 26 on the substrate 12 through Au wires.