Heat dissipation plate with inlay pin and its assembly components

Heat dissipation plate with inlay pin and its assembly components are provided. The heat dissipation plate covered the semiconductor use its inverse-hook type inlay pin through the hole of the carrier substrate to fix. The heat dissipation plate is through and hooks the carrier substrate so there is...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHANG, CHUANG-MING, CHEN, HUI-PIN, CHIANG, HUA-WEN, SHIE, WEN-LE, HUANG, NING
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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