Heat dissipation plate with inlay pin and its assembly components

Heat dissipation plate with inlay pin and its assembly components are provided. The heat dissipation plate covered the semiconductor use its inverse-hook type inlay pin through the hole of the carrier substrate to fix. The heat dissipation plate is through and hooks the carrier substrate so there is a pressure force. The pressure force provides a pressure control to the covered semiconductor so a well gap control can be gotten and is good for heat dissipation. Besides, because the heat dissipation plat has through holes through the carrier substrate, it is able to produce a grounded conductive layer connecting to the through holes in the carrier substrate to let the heat dissipation plate also has a ground function. Because the heat dissipation plate connects to the semiconductor, the current passing induced noise can be filtered and the inductance can be reduced. The assembly bottom layer is also able to plant tin balls that connect to the circuits of the carrier substrate. When the tin balls connect to the printed circuit board (PCB), the inlay pin of the heat dissipation plate can connects to the PCB to increase the strength, heat dissipation capability and electrical characteristics of the whole package.