A modular control system and method for a cmp tool

A system and method for an automated chemical mechanical planarization (CMP) machine. The system comprises a plurality of interchangeable CMP process modules. Each module is a compilation of grouped software codes called ""objects"". Process modules may be added or deleted from t...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	FRESEMAN, MARK, NIMTZ, JACK F, SMITH, RANDY, RICKORDS, GARY
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A system and method for an automated chemical mechanical planarization (CMP) machine. The system comprises a plurality of interchangeable CMP process modules. Each module is a compilation of grouped software codes called ""objects"". Process modules may be added or deleted from the system as needed, whether during the machine's assembly or during actual use. The system is configured to allow users to input a process ""recipe"" for each wafer of a wafer cassette which will guide the system to process the wafer in a desired way.