Wafer structure
A wafer structure is disclosed which includes the wafer body and the seal ring. Plural dicing channels are provided on the wafer body, and integrated circuit regions are formed through the dicing channels. The seal ring is arranged at the periphery of the integrated circuit region. The aforementione...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A wafer structure is disclosed which includes the wafer body and the seal ring. Plural dicing channels are provided on the wafer body, and integrated circuit regions are formed through the dicing channels. The seal ring is arranged at the periphery of the integrated circuit region. The aforementioned conductive seal ring is formed by the first conductive component and the second conductive component, which has a resistance different from that of the first conductive component and is electrically connected with the first conductive component. |
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