Laminable dry film useful in the production of printed wiring boards

A laminable dry film useful for forming a permanent dielectric area on a generally planar printed wiring board surface, said surface having circuit board elements attached to and rising above the wiring board planar surface, said film comprising: a first thermosetting polymeric layer for adhering the film to the printed wiring board surface and for encapsulating the circuit board elements, said first layer being soluble in aqueous alkaline solution; and a second thermosetting polymeric layer adhered to said first layer and comprising a positive-acting photosensitive agent for increasing the solubility of the first layer after exposure to actinic radiation, said second layer capable of remaining planar and generally parallel to said wiring board surface after said film is laminated to said wiring board surface; wherein said first thermosetting layer comprises: a polyurethane formed by mixing a polyisocyanate resin and a phenolic novolac resin in a carrier solution, said polyisocyanate resin and said phenolic resin totaling between 10 and 50 weight percent of the nonvolatile components of said layer, and said polyisocyanate and phenolic resins present in an amount such that the mole equivalent ratio of phenolic to isocyanate moieties is between 2 and 20; a basic catalyst, selected from the group consisting of heterocyclic amines, tertiary aromatic amines and tertiary-amino phenols, in the amount of 0.01 to 5 weight percent of the nonvolatile components of said layer; an epoxy resin, selected from the group consisting of aromatic glycidal ethers, aliphatic glycidal ethers and cycloaliphatic oxiranes, in the amount of 20 to 50 weight percent of the nonvolatile components of said layer; and said second thermosetting layer comprises: a polyurethane formed by mixing a polyisocyanate resin and a phenolic novolac resin in a carrier solution, said polyisocyanate resin and said phenolic resin totaling between 10 and 50 weight percent of the nonvolatile components of said layer, and said polyisocyanate and phenolic resins present in an amount such that the mole equivalent ratio of phenolic to isocyanate moieties between 2 and 20; a basic catalyst, selected from the group consisting of heterocyclic amines, tertiary aromatic amines and tertiary-amino phenols, in the amount of 0.01 to 5 weight percent of the nonvolatile components of said layer; an epoxy resin, selected from the group consisting of aromatic glycidal ethers, aliphatic glycidal ethers and cycloaliphatic ox