Semiconductor wire bonding method preventing wire sweeping
The present invention relates to a semiconductor wire bonding method preventing wire sweeping, which is to bend upward the wires which are connecting between the first bonding pad and the second bonding pad so as to provide a lateral shift of the wires toward the first bonding pad and the second bon...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | The present invention relates to a semiconductor wire bonding method preventing wire sweeping, which is to bend upward the wires which are connecting between the first bonding pad and the second bonding pad so as to provide a lateral shift of the wires toward the first bonding pad and the second bonding pad. Therefore, the shift of the wires can enhance the lateral strength of the wires to resist the impact of the mold flow and the shift can form a deformable space for the wires under mold flow. |
|---|