Adhesive of flexible printed circuit
The present invention discloses an adhesive for use of flexible printed circuits, comprising the following components: (a) an epoxy; (b) a catalyst with a weight proportion to the epoxy from 1:5 to 10:1, having a structure of one of the following general formulas, wherein, E is sulfur, nitrogen, or...
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| creator | LIN, FU-LE YOU, GUO-HUA+ HUANG, SUNG-JEN HUNG, TZ-JIN CHEN, JIN-PING |
| description | The present invention discloses an adhesive for use of flexible printed circuits, comprising the following components: (a) an epoxy; (b) a catalyst with a weight proportion to the epoxy from 1:5 to 10:1, having a structure of one of the following general formulas, wherein, E is sulfur, nitrogen, or phosphorus; Ar is aromatic rign; R1 is substituted or unsubstituted univalent alkyl, hydroxyl, alkoxyl, nitro group, cyanogen, or halogen; R2 and R3 are respectively hydrogen atom or methyl; R4 is substituted or unsubstituted univalent alkyl; R5 is substituted or unsubstituted pyrrolidine onium a is an integer from 0 to 2; b is an integer of 2 or 3; (c) a carboxyl terminated butadiene acrylonitrile with a weight proportion to the epoxy from 1:5 to 10:1; and (d) an inorganic filler with a weight proportion to the epoxy from 1:2 to 2:1. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW454032BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW454032BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW454032BB3</originalsourceid><addsrcrecordid>eNrjZFBxTMlILc4sS1XIT1NIy0mtyEzKSVUoKMrMK0lNUUjOLEouzSzhYWBNS8wpTuWF0twM8m6uIc4euqkF-fGpxQWJyal5qSXxIeEmpiYGxkZOTsaEVQAAex0mNw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Adhesive of flexible printed circuit</title><source>esp@cenet</source><creator>LIN, FU-LE ; YOU, GUO-HUA+ ; HUANG, SUNG-JEN ; HUNG, TZ-JIN ; CHEN, JIN-PING</creator><creatorcontrib>LIN, FU-LE ; YOU, GUO-HUA+ ; HUANG, SUNG-JEN ; HUNG, TZ-JIN ; CHEN, JIN-PING</creatorcontrib><description>The present invention discloses an adhesive for use of flexible printed circuits, comprising the following components: (a) an epoxy; (b) a catalyst with a weight proportion to the epoxy from 1:5 to 10:1, having a structure of one of the following general formulas, wherein, E is sulfur, nitrogen, or phosphorus; Ar is aromatic rign; R1 is substituted or unsubstituted univalent alkyl, hydroxyl, alkoxyl, nitro group, cyanogen, or halogen; R2 and R3 are respectively hydrogen atom or methyl; R4 is substituted or unsubstituted univalent alkyl; R5 is substituted or unsubstituted pyrrolidine onium a is an integer from 0 to 2; b is an integer of 2 or 3; (c) a carboxyl terminated butadiene acrylonitrile with a weight proportion to the epoxy from 1:5 to 10:1; and (d) an inorganic filler with a weight proportion to the epoxy from 1:2 to 2:1.</description><edition>7</edition><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMISTRY ; DYES ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2001</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20010911&DB=EPODOC&CC=TW&NR=454032B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20010911&DB=EPODOC&CC=TW&NR=454032B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIN, FU-LE</creatorcontrib><creatorcontrib>YOU, GUO-HUA+</creatorcontrib><creatorcontrib>HUANG, SUNG-JEN</creatorcontrib><creatorcontrib>HUNG, TZ-JIN</creatorcontrib><creatorcontrib>CHEN, JIN-PING</creatorcontrib><title>Adhesive of flexible printed circuit</title><description>The present invention discloses an adhesive for use of flexible printed circuits, comprising the following components: (a) an epoxy; (b) a catalyst with a weight proportion to the epoxy from 1:5 to 10:1, having a structure of one of the following general formulas, wherein, E is sulfur, nitrogen, or phosphorus; Ar is aromatic rign; R1 is substituted or unsubstituted univalent alkyl, hydroxyl, alkoxyl, nitro group, cyanogen, or halogen; R2 and R3 are respectively hydrogen atom or methyl; R4 is substituted or unsubstituted univalent alkyl; R5 is substituted or unsubstituted pyrrolidine onium a is an integer from 0 to 2; b is an integer of 2 or 3; (c) a carboxyl terminated butadiene acrylonitrile with a weight proportion to the epoxy from 1:5 to 10:1; and (d) an inorganic filler with a weight proportion to the epoxy from 1:2 to 2:1.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2001</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFBxTMlILc4sS1XIT1NIy0mtyEzKSVUoKMrMK0lNUUjOLEouzSzhYWBNS8wpTuWF0twM8m6uIc4euqkF-fGpxQWJyal5qSXxIeEmpiYGxkZOTsaEVQAAex0mNw</recordid><startdate>20010911</startdate><enddate>20010911</enddate><creator>LIN, FU-LE</creator><creator>YOU, GUO-HUA+</creator><creator>HUANG, SUNG-JEN</creator><creator>HUNG, TZ-JIN</creator><creator>CHEN, JIN-PING</creator><scope>EVB</scope></search><sort><creationdate>20010911</creationdate><title>Adhesive of flexible printed circuit</title><author>LIN, FU-LE ; YOU, GUO-HUA+ ; HUANG, SUNG-JEN ; HUNG, TZ-JIN ; CHEN, JIN-PING</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW454032BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2001</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>LIN, FU-LE</creatorcontrib><creatorcontrib>YOU, GUO-HUA+</creatorcontrib><creatorcontrib>HUANG, SUNG-JEN</creatorcontrib><creatorcontrib>HUNG, TZ-JIN</creatorcontrib><creatorcontrib>CHEN, JIN-PING</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIN, FU-LE</au><au>YOU, GUO-HUA+</au><au>HUANG, SUNG-JEN</au><au>HUNG, TZ-JIN</au><au>CHEN, JIN-PING</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Adhesive of flexible printed circuit</title><date>2001-09-11</date><risdate>2001</risdate><abstract>The present invention discloses an adhesive for use of flexible printed circuits, comprising the following components: (a) an epoxy; (b) a catalyst with a weight proportion to the epoxy from 1:5 to 10:1, having a structure of one of the following general formulas, wherein, E is sulfur, nitrogen, or phosphorus; Ar is aromatic rign; R1 is substituted or unsubstituted univalent alkyl, hydroxyl, alkoxyl, nitro group, cyanogen, or halogen; R2 and R3 are respectively hydrogen atom or methyl; R4 is substituted or unsubstituted univalent alkyl; R5 is substituted or unsubstituted pyrrolidine onium a is an integer from 0 to 2; b is an integer of 2 or 3; (c) a carboxyl terminated butadiene acrylonitrile with a weight proportion to the epoxy from 1:5 to 10:1; and (d) an inorganic filler with a weight proportion to the epoxy from 1:2 to 2:1.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES |
| title | Adhesive of flexible printed circuit |
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