Adhesive of flexible printed circuit

The present invention discloses an adhesive for use of flexible printed circuits, comprising the following components: (a) an epoxy; (b) a catalyst with a weight proportion to the epoxy from 1:5 to 10:1, having a structure of one of the following general formulas, wherein, E is sulfur, nitrogen, or...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	LIN, FU-LE, YOU, GUO-HUA+, HUANG, SUNG-JEN, HUNG, TZ-JIN, CHEN, JIN-PING
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention discloses an adhesive for use of flexible printed circuits, comprising the following components: (a) an epoxy; (b) a catalyst with a weight proportion to the epoxy from 1:5 to 10:1, having a structure of one of the following general formulas, wherein, E is sulfur, nitrogen, or phosphorus; Ar is aromatic rign; R1 is substituted or unsubstituted univalent alkyl, hydroxyl, alkoxyl, nitro group, cyanogen, or halogen; R2 and R3 are respectively hydrogen atom or methyl; R4 is substituted or unsubstituted univalent alkyl; R5 is substituted or unsubstituted pyrrolidine onium a is an integer from 0 to 2; b is an integer of 2 or 3; (c) a carboxyl terminated butadiene acrylonitrile with a weight proportion to the epoxy from 1:5 to 10:1; and (d) an inorganic filler with a weight proportion to the epoxy from 1:2 to 2:1.