Method to produce a semiconductor element and a semiconductor element produced by said method

A method to produce a semiconductor element is designed, where said semiconductor element is composed of a semiconductor chip with a first structured metal-layer on a surface, said metal-layer is covered by a passivation-layer, which has some openings. These metal-layers that are exposed through these openings can served as contact-pads or separation-positions on the upper side of said structured semiconductor chip is applied an adhesive layer on the whole surface, where said separation-positions in the first metal-layer of said semiconductor chip are covered by said adhesive layer.