Circular stripline package incorporating a MMIC low noise amplifier
A circular low noise amplifier package (10) having an X-band MMIC low noise amplifier (16) disposed therein, that may be preferably used with an existing stripline receiver board (11) employed in a missile. The package (10) has three input/output ports symmetrically located around the package (10),...
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| creator | HALLIDAY, JOHN J GORDON, ALLEN H TORGESON, GEORGE P |
| description | A circular low noise amplifier package (10) having an X-band MMIC low noise amplifier (16) disposed therein, that may be preferably used with an existing stripline receiver board (11) employed in a missile. The package (10) has three input/output ports symmetrically located around the package (10), including DC bias, RF input, and RF output ports. The package (10) mounts directly into the stripline receiver board (11) as a drop-in replacement for an isolator used in the existing stripline receiver board (11). The circular low noise amplifier package (10) having a top cover (12), an upper RF gasket (13), a package lid (14), a hermetic low noise amplifier module (15) containing a low noise amplifier chip (16), a lower RF gasket (17), and a bottom cover (18). The amplifier module (15) has feedthrough pins (21) that extend through the outer wall thereof and couple to the low noise amplifier chip (16). The top and bottom covers (12, 18) are used to secure the amplifier package (10) to the stripline receiver board (11). The upper and lower RF gaskets (13, 17) aid in improving an RF ground. The package lid (14) is seam sealed to the amplifier module (15) to hermetically seal the entire package (10). |
| format | Patent |
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The package (10) has three input/output ports symmetrically located around the package (10), including DC bias, RF input, and RF output ports. The package (10) mounts directly into the stripline receiver board (11) as a drop-in replacement for an isolator used in the existing stripline receiver board (11). The circular low noise amplifier package (10) having a top cover (12), an upper RF gasket (13), a package lid (14), a hermetic low noise amplifier module (15) containing a low noise amplifier chip (16), a lower RF gasket (17), and a bottom cover (18). The amplifier module (15) has feedthrough pins (21) that extend through the outer wall thereof and couple to the low noise amplifier chip (16). The top and bottom covers (12, 18) are used to secure the amplifier package (10) to the stripline receiver board (11). The upper and lower RF gaskets (13, 17) aid in improving an RF ground. The package lid (14) is seam sealed to the amplifier module (15) to hermetically seal the entire package (10).</description><edition>7</edition><language>eng</language><subject>AMMUNITION ; AMPLIFIERS ; BASIC ELECTRIC ELEMENTS ; BASIC ELECTRONIC CIRCUITRY ; BLASTING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; EXPLOSIVE CHARGES, e.g. FOR BLASTING, FIREWORKS, AMMUNITION ; HEATING ; LIGHTING ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MECHANICAL ENGINEERING ; PRINTED CIRCUITS ; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE ; SEMICONDUCTOR DEVICES ; TRANSMISSION ; WAVEGUIDES ; WEAPONS</subject><creationdate>2001</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20010421&DB=EPODOC&CC=TW&NR=431072B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20010421&DB=EPODOC&CC=TW&NR=431072B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HALLIDAY, JOHN J</creatorcontrib><creatorcontrib>GORDON, ALLEN H</creatorcontrib><creatorcontrib>TORGESON, GEORGE P</creatorcontrib><title>Circular stripline package incorporating a MMIC low noise amplifier</title><description>A circular low noise amplifier package (10) having an X-band MMIC low noise amplifier (16) disposed therein, that may be preferably used with an existing stripline receiver board (11) employed in a missile. The package (10) has three input/output ports symmetrically located around the package (10), including DC bias, RF input, and RF output ports. The package (10) mounts directly into the stripline receiver board (11) as a drop-in replacement for an isolator used in the existing stripline receiver board (11). The circular low noise amplifier package (10) having a top cover (12), an upper RF gasket (13), a package lid (14), a hermetic low noise amplifier module (15) containing a low noise amplifier chip (16), a lower RF gasket (17), and a bottom cover (18). The amplifier module (15) has feedthrough pins (21) that extend through the outer wall thereof and couple to the low noise amplifier chip (16). The top and bottom covers (12, 18) are used to secure the amplifier package (10) to the stripline receiver board (11). The upper and lower RF gaskets (13, 17) aid in improving an RF ground. 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The package (10) has three input/output ports symmetrically located around the package (10), including DC bias, RF input, and RF output ports. The package (10) mounts directly into the stripline receiver board (11) as a drop-in replacement for an isolator used in the existing stripline receiver board (11). The circular low noise amplifier package (10) having a top cover (12), an upper RF gasket (13), a package lid (14), a hermetic low noise amplifier module (15) containing a low noise amplifier chip (16), a lower RF gasket (17), and a bottom cover (18). The amplifier module (15) has feedthrough pins (21) that extend through the outer wall thereof and couple to the low noise amplifier chip (16). The top and bottom covers (12, 18) are used to secure the amplifier package (10) to the stripline receiver board (11). The upper and lower RF gaskets (13, 17) aid in improving an RF ground. The package lid (14) is seam sealed to the amplifier module (15) to hermetically seal the entire package (10).</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | AMMUNITION AMPLIFIERS BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY EXPLOSIVE CHARGES, e.g. FOR BLASTING, FIREWORKS, AMMUNITION HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE SEMICONDUCTOR DEVICES TRANSMISSION WAVEGUIDES WEAPONS |
| title | Circular stripline package incorporating a MMIC low noise amplifier |
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