Circular stripline package incorporating a MMIC low noise amplifier

A circular low noise amplifier package (10) having an X-band MMIC low noise amplifier (16) disposed therein, that may be preferably used with an existing stripline receiver board (11) employed in a missile. The package (10) has three input/output ports symmetrically located around the package (10), including DC bias, RF input, and RF output ports. The package (10) mounts directly into the stripline receiver board (11) as a drop-in replacement for an isolator used in the existing stripline receiver board (11). The circular low noise amplifier package (10) having a top cover (12), an upper RF gasket (13), a package lid (14), a hermetic low noise amplifier module (15) containing a low noise amplifier chip (16), a lower RF gasket (17), and a bottom cover (18). The amplifier module (15) has feedthrough pins (21) that extend through the outer wall thereof and couple to the low noise amplifier chip (16). The top and bottom covers (12, 18) are used to secure the amplifier package (10) to the stripline receiver board (11). The upper and lower RF gaskets (13, 17) aid in improving an RF ground. The package lid (14) is seam sealed to the amplifier module (15) to hermetically seal the entire package (10).