Method for forming solder bumps of improved height and devices formed

This invention is a manufacturing method for forming solder balls of an improved height and the structure thereof, particularly to provide a manufacturing method to increase the height of solder balls in a process of forming solder balls on an electric substrate (such as a silicon substrate). According to this invention, solder bumps are first formed on the electric substrate using one of the traditional methods, such as evaporating, electroplating, electroless plating, or solder-paste printing. Then the electric substrate is made to face downward in a reflow process and the electric substrate and its carrier are raised using a proper pad. The height of the solder balls is increased due to gravity thus the reliability of solder bumps after assembly is enhanced. The height of solder balls obtained based on the manufacturing method of this invention can be improved by at least 5%, or 10% for a better case, such that the distance between solder balls is increased by at least 5% thus the probability of solder ball touching is reduced.