Electronic components, lead wire used for electronic components and methods of manufacturing the same

The electronic components of the present invention use lead wires covered with resin film, which acts as a release agent and has the thickness of from 10 angstroms to 1000 angstroms. Above resin film is made by coating the lead wire with liquid resin or solution of the resin followed by a drying and a heat treatment. Another method of manufacturing the resin film is continuous coating and heat treatment during the production process of the lead wire. The electronic components using the lead wires of the present invention have excellent solderability. When the lead wires are applied to the film capacitors, an excellent increase in voltage endurance and excellent reliability can be achieved.