Semiconductor integrated circuit device having dummy bonding wires
There is provided semiconductor IC device having dummy bonding wires. The dummy bonding wires prevent the sweep of the bonding wires in the device by blocking them from the direct exposure to the molding resin flow front in the mold cavity. The present invention allows a reduction of the size of the...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | There is provided semiconductor IC device having dummy bonding wires. The dummy bonding wires prevent the sweep of the bonding wires in the device by blocking them from the direct exposure to the molding resin flow front in the mold cavity. The present invention allows a reduction of the size of the semiconductor IC device by increasing the allowable length of the bonding wires in the device, resulting in an improvement of the yield as well as a reduction of the production cost. |
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