Method/structure for creating aluminum wirebond pad on copper beol

The present invention provides a method for fabricating an integrated circuit (IC) structure having an A1 contact in electrical communication with Cu wiring embedded in the initial semiconductor wafer. In accordance with the method of the present invention, the A1 contact is formed in areas of the I...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	COSTRINI, GREGORY, MCDEVITT, THOMAS L, HEIDENREICH III, JOHN E, GOLDBLATT, RONALD D
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention provides a method for fabricating an integrated circuit (IC) structure having an A1 contact in electrical communication with Cu wiring embedded in the initial semiconductor wafer. In accordance with the method of the present invention, the A1 contact is formed in areas of the IC structure which contain or do not contain an underlying region of Cu wiring. The present invention also provides a method of interconnecting the fabricated structure to a semiconducting packaging material through the use of a wirebond or Controlled Collapse Chip Connection (C4) solder.