Method and apparatus for sputter etch conditioning a ceramic body

A method and apparatus for conditioning a surface of a ceramic body in a process chamber when the process chamber has a vacuum pump, an anode and a cathode. The conditioning method consists of pumping the process chamber down to a vacuum with the vacuum pump, introducing a gas into the chamber, ener...

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Bibliographische Detailangaben
Hauptverfasser: KHURANA, NITIN, TZOU, EUGENE, BURKHART, VINCE, PARKHE, VIJAY, SANSONI, STEVE
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A method and apparatus for conditioning a surface of a ceramic body in a process chamber when the process chamber has a vacuum pump, an anode and a cathode. The conditioning method consists of pumping the process chamber down to a vacuum with the vacuum pump, introducing a gas into the chamber, energizing the anode and cathode with RF power to ignite the gas into a plasma, sputter etching the surface with ions from the plasma to remove contaminants therefrom. The method is accomplished either within a process chamber to condition, in situ, a ceramic chuck or within a cleaning chamber to condition any form of ceramic body or component.