A coating layers having heat resistance and mold releasing and the method of the formation thereof

A coating layers having heat resistance and mold releasing characterized in that comprises: (a) a layer A in combination consisting of 20 to 95 % by weight of frit, and at least one of the 5 to 80 % by weight of heat resistant resins, which are selected from the group of fluorine resins, silicon res...

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Bibliographische Detailangaben
1. Verfasser:	OKITA KAZUMASA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BORING CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS DYES FILLING PASTES GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS INKS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS POLISHES PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS SPRAYING OR ATOMISING IN GENERAL TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING TURNING USE OF MATERIALS THEREFOR WOODSTAINS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A coating layers having heat resistance and mold releasing characterized in that comprises: (a) a layer A in combination consisting of 20 to 95 % by weight of frit, and at least one of the 5 to 80 % by weight of heat resistant resins, which are selected from the group of fluorine resins, silicon resins, aromatic polysulfone resins, polyphenylenesulfide resins, polyamidoimide resins and poly imide resins giving the formation component of the underfilm; (b) a layer B which is formed and covered on the surface of the layer A, the formation components of the layer B being consisting of 20 to 100 % by weight of fluorine resins, 0 to 20% by weight of frit, and at least one of the 0 to 80% by weight of heat resistant resins which are selected from the group of silicon resins, aromatic polysulfone resins, polyphenylenesulfide resins, polyamidoimide resins and polyimide resins.