Method of polishing a surface of copper or an alloy comprising mainly copper, magnetic head obtainable by means of the method
A method of polishing a surface of copper or an alloy comprising mainly copper, comprising the steps of moving a polishing means and the surface with respect to each other while exerting a polishing pressure of between 400 and 600 g/cm2 on the surface with the polishing means for obtaining a polishe...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | A method of polishing a surface of copper or an alloy comprising mainly copper, comprising the steps of moving a polishing means and the surface with respect to each other while exerting a polishing pressure of between 400 and 600 g/cm2 on the surface with the polishing means for obtaining a polished surface, which is characterized in the polishing means comprising a composition comprising a colloidal suspension of SiO2 particles having an average particle size of between 20 and 50 nm in an alkali solution, demineralised water and a chemical activator, and the polishing means also comprising an absorbent polishing base having a hardness in the range between Shore A hardness 40 and Shore D hardness 90. |
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