Adhesive for soft printed circuit board (PCB), process for making the same, and use of such an adhesive in making a soft PCB

An adhesive base for soft printed circuit board (PCB), which comprises: (a) 100 parts by weight of an epoxy resin having at least two epoxy functional groups in each molecule; (b) 30~100 parts by weight of a rubber containing -COOH, -CN or -OH functional groups; (c) 0.01~1.0 parts by weight of a ter...

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Hauptverfasser: LI, SHIAWYN, TZENG, TZENG-YOW, HWANG, YEONG-TSYR
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:An adhesive base for soft printed circuit board (PCB), which comprises: (a) 100 parts by weight of an epoxy resin having at least two epoxy functional groups in each molecule; (b) 30~100 parts by weight of a rubber containing -COOH, -CN or -OH functional groups; (c) 0.01~1.0 parts by weight of a tertiary amine main catalyst of the formula (I) or (II) (I) (II) in which n is an integer of 1-4; A is -OH or =O; R1, R2, R3 and R4 are C1-C8 alkyl, C1-C8 ether group, or C1-C8 alkyl substituted by OH; (d) 100~400 parts by weight of a solvent; (e) 2~30 parts by weight of a filler; and (f) 0~10 parts by weight of an antioxidant.