Thermocouple of apparatus for manufacturing semiconductor device
A type of thermocouple for the manufacturing of semiconductors comprising: 2 metal wires of different materials of which one end of both is connected; the first insulator coated on one of the metal wires from the joint to the first length; a second insulator with a brittleness factor lower than that...
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| creator | DONG-OK JUNG |
| description | A type of thermocouple for the manufacturing of semiconductors comprising: 2 metal wires of different materials of which one end of both is connected; the first insulator coated on one of the metal wires from the joint to the first length; a second insulator with a brittleness factor lower than that of the first one for the coating of the bare part of the coated metal wires, from the first insulator to a second length. |
| format | Patent |
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a second insulator with a brittleness factor lower than that of the first one for the coating of the bare part of the coated metal wires, from the first insulator to a second length.</description><language>chi ; eng</language><subject>BLASTING ; COMBUSTION APPARATUS ; COMBUSTION PROCESSES ; ELECTRICITY ; HEATING ; LIGHTING ; MEASURING ; MEASURING QUANTITY OF HEAT ; MEASURING TEMPERATURE ; MECHANICAL ENGINEERING ; PHYSICS ; REGULATING OR CONTROLLING COMBUSTION ; TESTING ; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR ; WEAPONS</subject><creationdate>1998</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19980811&DB=EPODOC&CC=TW&NR=338101B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19980811&DB=EPODOC&CC=TW&NR=338101B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DONG-OK JUNG</creatorcontrib><title>Thermocouple of apparatus for manufacturing semiconductor device</title><description>A type of thermocouple for the manufacturing of semiconductors comprising: 2 metal wires of different materials of which one end of both is connected; the first insulator coated on one of the metal wires from the joint to the first length; a second insulator with a brittleness factor lower than that of the first one for the coating of the bare part of the coated metal wires, from the first insulator to a second length.</description><subject>BLASTING</subject><subject>COMBUSTION APPARATUS</subject><subject>COMBUSTION PROCESSES</subject><subject>ELECTRICITY</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MEASURING</subject><subject>MEASURING QUANTITY OF HEAT</subject><subject>MEASURING TEMPERATURE</subject><subject>MECHANICAL ENGINEERING</subject><subject>PHYSICS</subject><subject>REGULATING OR CONTROLLING COMBUSTION</subject><subject>TESTING</subject><subject>THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1998</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAIyUgtys1Pzi8tyElVyE9TSCwoSCxKLCktVkjLL1LITcwrTUtMLiktysxLVyhOzc1Mzs9LKU0uAcqlpJZlJqfyMLCmJeYUp_JCaW4GeTfXEGcP3dSC_PjU4oLE5NS81JL4kHBjYwtDA0MnJ2PCKgB5eDGk</recordid><startdate>19980811</startdate><enddate>19980811</enddate><creator>DONG-OK JUNG</creator><scope>EVB</scope></search><sort><creationdate>19980811</creationdate><title>Thermocouple of apparatus for manufacturing semiconductor device</title><author>DONG-OK JUNG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW338101BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; 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the first insulator coated on one of the metal wires from the joint to the first length; a second insulator with a brittleness factor lower than that of the first one for the coating of the bare part of the coated metal wires, from the first insulator to a second length.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
| recordid | cdi_epo_espacenet_TW338101BB |
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| subjects | BLASTING COMBUSTION APPARATUS COMBUSTION PROCESSES ELECTRICITY HEATING LIGHTING MEASURING MEASURING QUANTITY OF HEAT MEASURING TEMPERATURE MECHANICAL ENGINEERING PHYSICS REGULATING OR CONTROLLING COMBUSTION TESTING THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR WEAPONS |
| title | Thermocouple of apparatus for manufacturing semiconductor device |
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