Thermocouple of apparatus for manufacturing semiconductor device

A type of thermocouple for the manufacturing of semiconductors comprising: 2 metal wires of different materials of which one end of both is connected; the first insulator coated on one of the metal wires from the joint to the first length; a second insulator with a brittleness factor lower than that...

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1. Verfasser: DONG-OK JUNG
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:A type of thermocouple for the manufacturing of semiconductors comprising: 2 metal wires of different materials of which one end of both is connected; the first insulator coated on one of the metal wires from the joint to the first length; a second insulator with a brittleness factor lower than that of the first one for the coating of the bare part of the coated metal wires, from the first insulator to a second length.