Top loading socket for ball grid arrays

A socket for a ball grid array integrated circuit package (BGA) includes: (1) a lid having a top structure providing entry openings that allow the ball contacts of a BGA package to enter the openings, packaging a socket for BGA, and defining the first plane by ball contact; (2) a guide surface to align the ball contacts with openings; at least one edge of the first end of the socket, where electrical contacts is fixed on it, mating with ball contact; the first end extending into the openings of the cover from the reverse direction of ball contact; defining openings in-between electric contact point and the edge of punch through holes; (3) a spring loaded plate driving the plate parallel to the plane of the ball contacts in a manner that reduces the entry hole oening; (4) a driving set to pressing down the lid for loading the spring to enlarge the openings; the lid is pushed down and the BGA package is guided with no or zero insertion force into the socket where the ball contacts enter the holes; releasing the