Semiconductor device and process for producing the same

A semiconductor integrated circuit device, which comprises installing a wiring substrate by a resilient structure body on the major plane of the semiconductor chip, electrically connecting one side of the wiring of the wiring substrate with the external terminal on the major plane of the semiconduct...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SHIBAMOTO MASAKUN, AKIYAMA YUKIJI, ANJOU ICHIROU, MIYAZAKI CHUUICHI, SHIMOISHI TOMOAKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	A semiconductor integrated circuit device, which comprises installing a wiring substrate by a resilient structure body on the major plane of the semiconductor chip, electrically connecting one side of the wiring of the wiring substrate with the external terminal on the major plane of the semiconductor chip, and connecting the other side of the wiring of the wiring substrate with the contact electrode, which is characterized in that the wiring substrate is formed on an insulation zone and the major plane, the side of the insulation zone is installed with the resilient structure body, and the wiring side is formed with the contact electrode.