Pick-and-place apparatus and method

Aspects of the present disclosure relate to a method for transferring a plurality of electrical components from a source substrate to a plurality of empty positions on a target substrate. Further aspects of the present disclosure relate to an apparatus for carrying out this method and to a corresponding computer program product. According to an aspect of the present disclosure a binning map is constructed of the source substrate by assigning each electrical component among the plurality of electrical components to a respective bin among M bins based on one or more parameters of the electrical components. The target substrate is divided into a plurality of unit cells, wherein each unit cell comprises a plurality of component positions, each component position being associated with a respective bin among the plurality of bins. The electrical components are arranged on the target substrate such that, at each component position of each unit cell, an electrical component from the source substrate is arranged that