Bulk acoustic wave structures with thermal dissipation structures, and fabrication methods thereof

Bulk acoustic wave structures with thermal dissipation structures, and fabrication methods thereof

A bulk acoustic wave (BAW) device includes a transducer die, a thermal dissipation layer, and a molding layer. The transducer die includes a BAW transducer and is mounted on a circuit on a first surface of the transducer die. The thermal dissipation layer is thermally coupled to the transducer die o...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: PARKER, STEPHEN CRAIG, WILLIS, DON, MANGOLD, TOBIAS
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRONIC CIRCUITRY
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
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Beschreibung
Zusammenfassung:A bulk acoustic wave (BAW) device includes a transducer die, a thermal dissipation layer, and a molding layer. The transducer die includes a BAW transducer and is mounted on a circuit on a first surface of the transducer die. The thermal dissipation layer is thermally coupled to the transducer die on a second surface of the transducer die. The molding layer encapsulates the transducer die and the thermal dissipation layer.