Temperature control system, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

The present disclosure provide a technique capable of improving a temperature controllability of a process space where a substrate is placed. There is provided a technique that includes: a heater arranged in each of a plurality of zones; at least one first temperature sensor configured to be capable...

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Bibliographische Detailangaben
Hauptverfasser:	NAKANISHI, KENTO, YAMAGUCHI, HIDETO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The present disclosure provide a technique capable of improving a temperature controllability of a process space where a substrate is placed. There is provided a technique that includes: a heater arranged in each of a plurality of zones; at least one first temperature sensor configured to be capable of operating in conjunction with at least one substrate; another temperature sensor aside from the at least one first temperature sensor; and a controller configured to be capable of controlling the heater based on a temperature detected by either the at least one first temperature sensor or the another temperature sensor, wherein the either the at least one first temperature sensor or the another temperature sensor is assigned to each of the plurality of zones.