Semiconductor structure and fabricating method thereof
A method comprises bonding a first wafer with a second wafer through wafer-on-wafer bonding, wherein the second wafer includes a first plurality of device dies therein. A second plurality of device dies are bonded on the second wafer through chip-on-wafer bonding. A gap-filling process is performed...
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| creator | CHUNG, MING-TSU LIN, YUNGI |
| description | A method comprises bonding a first wafer with a second wafer through wafer-on-wafer bonding, wherein the second wafer includes a first plurality of device dies therein. A second plurality of device dies are bonded on the second wafer through chip-on-wafer bonding. A gap-filling process is performed to fill the gaps between the second plurality of device dies with gap-filling regions. The gap-filling regions and the second plurality of device dies collectively form a reconstructed wafer. |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Semiconductor structure and fabricating method thereof |
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