Substrate processing apparatus, method of manufacturing semiconductor device, and program

There is provided a technique that includes: a substrate processor configured to process a substrate according to a recipe including at least one step defining a substrate processing condition; an operator configured to receive an editing operation for at least one setting item included in the subst...

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Bibliographische Detailangaben
Hauptverfasser: YAMAOKA, YUJI, EKKO, HIROSHI, MORI, SHINICHIRO, MITSUI, HIROYUKI, TAKATA, KYO
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:There is provided a technique that includes: a substrate processor configured to process a substrate according to a recipe including at least one step defining a substrate processing condition; an operator configured to receive an editing operation for at least one setting item included in the substrate processing condition; a calculator configured to calculate a control value for a setting value of the at least one setting item in conformity with an edited substrate processing condition obtained by the editing operation; and a controller configured to be capable of controlling a displayer to display time-series data of the control value calculated by the calculator together with information about the at least one step.